2-component epoxy adhesives

Use our product overview, let yourself be inspired and get a feeling for what our thermally conductive adhesives can do for you.

Polytec TC 417-2

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 24 hours
  • Operating Temperature: -55 °C ... 180 °C
  • Consistency: flowable paste
  • Features: cures at room temperature, good thermal conductivity, excellent moisture and chemical resistance, very good flowability, solvent-free

Polytec TC 430

  • Number of Components: 2
  • Typical Cure Schedule: 150 °C / 15 minutes
  • Operating Temperature: -55 °C ... 250 °C
  • Consistency: soft thixotropic paste
  • Features: non-abrasive, fine Boron Nitride Filler, high Glass Transition Temperature, excellent thermal stability, highly electrically insulating

Polytec TC 432

  • Number of Components: 2
  • Typical Cure Schedule:  23 °C / 24 hours
  • Operating Temperature: 190 °C
  • Consistency: thixotropic paste
  • Features: non-abrasive Boron Nitride Filler, high thermal conductivity (1,8 W/mK),  highly electrically insulating

Polytec TC 433

  • Number of Components: 2
  • Typical Cure Schedule:  150 °C / 15 minutes
  • Operating Temperature: ca. 220 °C
  • Consistency: thixotropic paste
  • Features: non-abrasive Boron Nitride Filler, very good thermal conductivity (2 W/mK), high Glass Transition Temperature, excellent thermal stability, highly electrically insulating

Polytec TC 451

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 24 hours
  • Operating Temperature: -55 °C ... 180 °C
  • Consistency: flowable soft paste
  • Features: thermally conductive adhesive and potting compound, cures at room temperature, excellent adhesion on most substrates