Durapot® 809

  • Number of Components: 2
  • Typical Cure Schedule: RT / 24 hours
  • Operating Temperature: 1530 °C
  • Consistency: powder + water
  • Features: Electrically Resistant Cement. Commonly used in ignitions, heating coils, electronics, as well as many production applications.

Resbond® 906

  • Number of Components: 2
  • Typical Cure Schedule: RT / 48 hours + post-curing >120°C
  • Operating Temperature: 1650 °C
  • Consistency: powder/binder
  • Features: Based on MgO, high expansion, 4 h pot life.

Resbond® 908

  • Number of Components: 2
  • Typical Cure Schedule: RT / 8 hours + post-curing >120 °C / >2 hours
  • Operating Temperature: 1650 °C
  • Consistency: powder/binder
  • Features: Al2O3-based bonding, potting and encapsulating delicate electronic assembles, sensors, instruments and general purpose high temp. Applications.

Resbond® 918

  • Number of Components: 2 (powder + water)
  • Typical Cure Schedule: RT / 24 hours
  • Operating Temperature: 1370 °C
  • Consistency: powder/water
  • Features: screen printable

Resbond® 919

  • Number of Components: 2
  • Typical Cure Schedule: RT / 24 hours
  • Operating Temperature: 1540 °C
  • Consistency: powder/water
  • Features: Fast curing, high dielectric strength.

Resbond® 940

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C  / 4 - 8 hours or 80 °C / 5 minutes
  • Operating Temperature: 1090 °C
  • Consistency: powder/binder
  • Features: ZrO2-based, NASA approval, for non-absorbent surfaces. Fast setting adhesive used for sealing and assembling parts, encapsulate heating elements, or as electrically resistant coatings.