Number of Components: 2 Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 5 minutes Operating Temperature: -50 °C bis +260 °C Consistency: 3 600 mPas Features: Low-viscosity, unfilled potting compound for larger volumes Number of Components: 2 Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 hour Operating Temperature: -50 °C up to +315 °C Consistency: 1 600 mPas Features: Hot-curing potting compound, unfilled Number of Components: 2 Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 -2 hours Operating Temperature: -50 °C … +315 °C Consistency: 2 000 mPas Features: Ultra high temp. potting with low thermal expansion and low water absorption. Commonly used in electronic assemblies to prevent vibration damage. Number of Components: 2 Typical Cure Schedule: 23 °C / 24 hours or 120 °C / 10 minutes Operating Temperature: -50 °C … +260 °C Consistency: 10 000 mPas Features: Thermally insulating potting compound Number of Components: 2 Typical Cure Schedule: 120 °C / 2 - 4 hours or 180 °C / 1 hour Operating Temperature: up to 260 °C Consistency: 800 mPas Features: High temp. flexible epoxy ideal for thermal shock applications, stress free potting and bonding 
