Durapot® 861

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 5 minutes
  • Operating Temperature: -50 °C bis +260 °C
  • Consistency: 3 600 mPas
  • Features: Low-viscosity, unfilled potting compound for larger volumes

Durapot® 862

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 hour
  • Operating Temperature: -50 °C up to  +315 °C
  • Consistency: 1 600 mPas
  • Features: Hot-curing potting compound, unfilled

Durapot® 863

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C / 4 hours or 180 °C / 1 -2 hours
  • Operating Temperature: -50 °C … +315 °C
  • Consistency: 2 000 mPas
  • Features: Ultra high temp. potting with low thermal expansion and low water absorption. Commonly used in electronic assemblies to prevent vibration damage.

Durapot® 866

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 24 hours or 120 °C / 10 minutes
  • Operating Temperature: -50 °C … +260 °C
  • Consistency: 10 000 mPas
  • Features: Thermally insulating potting compound

Durapot® 868

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C / 2 - 4 hours or 180 °C / 1 hour
  • Operating Temperature: up to 260 °C
  • Consistency: 800 mPas
  • Features: High temp. flexible epoxy ideal for thermal shock applications, stress free potting and bonding

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