Typical Cure Schedule: 23 °C / 24 hours + 120 °C / 1 hour and 180 °C / 1 hour
Operating Temperature: -50 °C … 260 °C
Consistency: low viscosity
Features: Low viscosity adhesive, potting and encapsulant. Ideal for ultra thin bond lines, sealing porous materials and protecting, bonding and coating critical electronic components, etc.
Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 1 hour
Operating Temperature: -50 °C … +220 °C
Consistency: 10 000 mPas
Features: Flexibility (Shore hardness) adaptable by adjusting the mixing ratio, dry surface, good adhesion to Teflon, ideal for all electrical and electronic applications
