Duralco® 4460

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C / 4 hours
  • Operating Temperature: -50 °C … +315°C
  • Consistency: 1 600 mPas
  • Features: Low viscosity and ultra temperature adhesive for sensors and plug-in contacts

Duralco® 4461

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 24 hours + 120 °C / 1 hour and 180 °C / 1 hour
  • Operating Temperature: -50 °C … 260 °C
  • Consistency: low viscosity
  • Features: Low viscosity adhesive, potting and encapsulant. Ideal for ultra thin bond lines, sealing porous materials and protecting, bonding and coating critical electronic components, etc.

Duralco® 4525

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 16-24 hours or 120 °C / 5 minutes
  • Operating Temperature: -50 °C … 260 °C
  • Consistency: 12 400 mPas
  • Features: Electrically resistant, all purpose potting - Small parts potting for electronics, or sensor potting with good thermal conductivity, D90

Duralco® 4525IP

  • Number of Components: 2
  • Typical Cure Schedule: 25 °C / 16-24 hours or 120 °C / 5 minutes
  • Operating Temperature: -50 °C bis +260 °C
  • Consistency: 24 000 mPas
  • Features: Sensor sealing, D90, thermal conductivity 1.85 W / mK

Duralco® 4538

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 16 - 24 hours or 120 °C / 1 hour
  • Operating Temperature: -50 °C … +220 °C
  • Consistency: 10 000 mPas
  • Features: Flexibility (Shore hardness) adaptable by adjusting the mixing ratio, dry surface, good adhesion to Teflon, ideal for all electrical and electronic applications

Duralco® NM25

  • Number of Components: 2
  • Typical Cure Schedule: 23 °C / 4 - 16 hours
  • Operating Temperature: 260 °C
  • Consistency: pasty
  • Features: Adhesive for magnet and ferrite bonding. Free of magnetic particles or conductive fillers. 

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