RSS-FEED Polytec PT at Bondexpo 2014 - hall 7 / stand 7602

The 8th Bondexpo, the "Trend-Setting Meeting Place for the Bonding Technology Industry",... (12.09.2014) read more >>

Product Overview

Electrically Conductive Adhesives

  • Die Attach / COB
  • Solder replacement
  • Medial-grade applications
  • Flip chip packaging
  • SDM attach
  • Antenna printing
  • EMI/RFI shielding

Thermally Conductive Adhesives

  • Heat dissipation
  • Chip bonding
  • Heat sink bonding
  • Power semiconductors
  • Potting applications

Optical Adhesives

  • Medial fiber bonding
  • Optical assembly
  • LED / LCD encapsulation
  • Optical lamination
  • Optical chip protection
  • Fiber Optics

UV-Curable Adhesives

  • Rapid cure
  • Optical assembly
  • Dual-cure
  • Electronics assembly
  • Medical applications

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