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Product extract

Electrically Conductive Adhesives

  • Die Attach / COB
  • Solder Replacement
  • Medial grade applications
  • Flip Chip packaging
  • SDM attach
  • Antenna Printing
  • EMI/RFI shielding

Thermally Conductive Adhesives

  • Heat dissipation
  • Chip bonding
  • Heat sink bonding
  • Power semiconductors
  • Potting applications

Optical / Fiber optics Adhesives

  • Medial fiber bonding
  • Optical assembly
  • LED / LCD encapsulation
  • Optical lamination
  • Optical Glob Top
  • Fiber Optics

Polyimide Adhesives and Coatings

  • High-temp resistant
  • Fiber optic applications
  • Electronic components assembly
  • Wafer Coating
  • Sensor for harsh environments
  • Autoclavable

UV-curable Adhesives

  • Rapid cure
  • Optical assembly
  • Dual-cure
  • Electronics assembly
  • Medical applications

Polytec PT - International Sales

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Polytec PT International
Creating Solutions Through Polymers

Tel. +49 (0) 7243 604-400
info@polytec-pt.de

Polytec PT Catalog 2011

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