Thermally Conductive Adhesives
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Processing | Cold-cured | Hot-cured | |||
Components | 2C | 1C | 2C | ||
Electrically insulating | Yes | Yes | No | Yes | No |
<1 W/mK | - | - | |||
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1-2 W/mK | - | - | |||
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2-4 W/mK | - | - |
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>4 W/mk | - | - | - | - | |
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Polytec TC 301
- Number of Components: 1
- Typical Cure Schedule: 150 °C / 10 minutes
- Operating Temperature: -55 °C ... 180 °C
- Consistency: creamy paste
- Features: Al-filled, excellent thermal conductivity (1,9 W/mK), single component, 100% solid, easy to use
Datasheet
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Polytec TC 304
- Number of Components: 1
- Typical Cure Schedule: 120 °C / 45 minutes
- Operating Temperature: -55 °C ... 180 °C
- Consistency: creamy paste
- Features: al-filled, good thermal conductivity, single component, 100% solid, easy to use
Datasheet
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Polytec TC 351
- Number of Components: 1
- Typical Cure Schedule: 150 °C / 10 minutes
- Operating Temperature: -55 °C ... 200 °C
- Consistency: thixotropic paste
- Features: heavy flowable paste, single component, thermally conductive, electrically insulating, 100% solid / solventless, excellent resistance to moisture and chemicals
Datasheet
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Polytec TC 417
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 24 hours
- Operating Temperature: -55 °C ... 200 °C
- Consistency: flowable paste
- Features: cures at room temperature, good thermal conductivity, excellent moisture and chemical resistance, very good flowability, 100% solid
Datasheet
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Polytec TC 418
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 48 hours
- Operating Temperature: 140 °C
- Consistency: high viscous
- Features: cures at room temperature, high thermal conductivity (1,6 W/mK), excellent moisture and chemical resistance, 100% solid
Datasheet
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Polytec TC 420
- Number of Components: 2
- Typical Cure Schedule: 150 °C / 5 minutes
- Operating Temperature: -55 °C ... 200 °C
- Consistency: soft paste
- Features: thermally conductive, electrically insulating adhesive and potting system, color change upon cure
Datasheet
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Polytec TC 423
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 16 hours
- Operating Temperature: 160 °C
- Consistency: high-viscosity
- Features: high thermal conductivity (3 W/mK), room temperature curing, high electrically insulating
Datasheet
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Polytec TC 430
- Number of Components: 2
- Typical Cure Schedule: 150 °C / 15 minutes
- Operating Temperature: -55 °C ... 200 °C
- Consistency: soft thixotropic paste
- Features: non abrasive, fine Boron Nitride Filler, high Glass Transition Temperature, excellent thermal stability, highly electrically insulating, long pot life
Datasheet
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Polytec TC 432
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 24 hours
- Operating Temperature: 190 °C
- Consistency: thixotropic paste
- Features: non abrasive Boron Nitride Filler, high thermal conductivity (1,8 W/mK), room temperature curing, high electrically insulating
Datasheet
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Polytec TC 433
- Number of Components: 2
- Typical Cure Schedule: 150 °C / 15 minutes
- Operating Temperature: ca. 220 °C
- Consistency: thixotropic paste
- Features: non abrasive Boron Nitride Filler, very good thermal conductivity (2 W/mK), high Glass Transition Temperature, excellent thermal stability, highly electrically insulating
Datasheet
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Polytec TC 437
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 16 hours
- Operating Temperature: ca. -55 °C ... 180 °C
- Consistency: thixotropic paste
- Features: non abrasive, fine Boron Nitride Filler, high Glass Transition Temperature, cures at room temperature, highly electrically insulating
Datasheet
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Polytec TC 451
- Number of Components: 2
- Typical Cure Schedule: 23 °C / 16 hours
- Operating Temperature: -55 °C ... 180 °C
- Consistency: flowable soft paste
- Features: thermally conductive adhesive and potting system, cures at room temperature, excellent adhesion on most substrates
Datasheet
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Your Contact
Epoxy Adhesives
Mr. Dirk Schlotter
Tel. +49 7243 604-4110
d.schlotter@polytec-pt.de
Product Brochure [PDF]
