New Adhesives for Thermal Challenges in Microelectronics Assemby

Thermally conductive mounting of power devices, e.g. LEDs, on respective heat sinks can be substantially enhanced by using Polytec’s TC 433 boron nitride filled adhesive featuring 2 W/mK thermal conductivity and a glass transition around 110 °C after thermal curing, and withstanding up to 220 °C continuous operation temperature. TC 432 is a modification curing at room temperature with a pot life of ca. 15 min, about 1.8 W/mK thermal conductivity and ca. 75 – 80 °C glass transition temperature.

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