Adhesive bonding of power modules can often be an alternative to usual joining techniques. Epoxy-based adhesives can generally produce high-strength and stable connections. Whether this also applies to the high requirements in power circuits was the subject of a research project recently performed by the IMTEK Department of Microsystems Engineering and the IESY Institute of Electric Power Systems at the University of Freiburg and Magdeburg, resp. Some of the project output has been published in Adhesion 2/2017, please see here

Data Protection

This website uses cookies. If you continue to use the website, we assume your consent.

Learn more about the use of cookies Close