Electrically Conductive Adhesives

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Processing

Cold-curing

Hot-curing

Components

1C

2C

1C

2C

Electronics applications high-strength

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EC 244

EC 101 L frozen

EC 101

 

 

EC 151 L frozen

EC 151 L

 

 

EC 112 L frozen

 

 

 

EC 242 frozen

 

Electronics applications flexible

PU 1000

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EC 201

 

 

 

 

 

 

 

 

Solar industry

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SB 1227 frozen

SB 1227

 

 

SB 1242 frozen

SB 1242

Electromagnetic shielding

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EC 262-2

 

 

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Polytec EC 101

  • Number of Components: 2
  • Typical Cure Schedule: 120 °C  / 15 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft, creamy paste
  • Features: USP class VI compliant ECA for die attach and chip bonding in microelectronic, medical and optoelectronic applications

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Polytec EC 101-L-frozen

  • Number of Components: 1
  • Typical Cure Schedule: 150 °C  / 5 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft, creamy paste
  • Features: high-volume chip bonding, dispenser, long pot life, IC packaging, hybrids, microelectronic applications

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Polytec EC 112-L-frozen

  • Number of Components: 1
  • Typical Cure Schedule: 150 °C / 5 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: creamy paste
  • Features: pre-mixed frozen ECA for screen printing applications in microelectronics and hybrid applications

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Polytec EC 151-L

  • Number of Components: 1
  • Typical Cure Schedule: 150 °C  / 5 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft paste
  • Features: pre-mixed frozen ECA for fast stamping and jet dispenser applications, LEDs, automotive electronics

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Polytec EC 151-L-frozen

  • Number of Components: 1
  • Typical Cure Schedule: 150 °C  / 5 minutes
  • Operating Temperature: -55 °C ... +200 °C
  • Consistency: soft paste
  • Features: pre-mixed frozen ECA for fast stamping and jet dispenser applications, LEDs, automotive electronics

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Polytec EC 201

  • Number of Components: 2
  • Typical Cure Schedule: 150 °C / 30 minutes
  • Operating Temperature: -55 °C ... +150 °C
  • Consistency: creamy paste
  • Features: very flexible electrically conductive epoxy / designed for 2 component meter mix and dispense systems

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Polytec EC 242-frozen

  • Number of Components: 1
  • Typical Cure Schedule: 150 °C / 30 minutes
  • Operating Temperature: 230 °C
  • Consistency: creamy paste
  • Features: pre-mixed-frozen, excellent electrical conductivity, 100% solid, thermal conductivity 4.2 W/mK

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Polytec EC 262-2

  • Number of Components: 2
  • Typical Cure Schedule: 150 °C / 30 minutes
  • Operating Temperature: -55 °C ... 180 °C
  • Consistency: heavy paste
  • Features: carbon-filled, high-temp ECA for EMV/ EMI and protection of copper contacts and similar metals

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Polytec PU-1000

  • Number of Components: 1
  • Typical Cure Schedule:  RT / 10-15 minutes
  • Operating Temperature: -55 °C ... 140 °C
  • Consistency: creamy paste
  • Features: electrically conductive PU-dispersion, great mechanical and chemical stability, excellent adhesion on metals, plastics and all porous surfaces

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SoltaBond SB1227

Silver-filled, electrically conductive epoxy adhesive with long pot life, for applications on rigid substrates such as glass. The adhesive is well suited for reliable bonds to most TCO´s and metallic contact surfaces. SoltaBond SB1227 is optimized for dispensing in the finest lines in automated high-speed production processes and can be cured during lamination without any outgassing. SoltaBond SB1227 can be supplied as a 1-component frozen adhesive, or as a 2-component (1:1 mix by weight) adhesive that can be stored and processed at room temperature.

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Your Contact

Epoxy Adhesives
Mr. Dirk Schlotter

Tel. +49 7243 604-4110
d.schlotter@polytec-pt.de

Product Brochure [PDF]

EC Journal 02/2016: