| Nr. |
Titel |
Beschreibung |
Datum |
Größe |
 64 |
High Frequency Properties of Passive Materials for Ultrasonic Transducers |
Epo-Tek 301 for Ultrasonic Transducers |
2001 |
948KB |
| 63 |
A Three Axis Micropositioner for ultrahighvacuum use based on the inertial slider principle |
UHV compatible Epo-Tek H35-175MPLV for bonding piezoelectric components |
1995 |
290KB |
| 62 |
Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting |
Epo-Tek UVO114 for molding against PDMS |
1998 |
910KB |
| 61 |
Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment |
Screen printable wafer coatings have many advantages over tradition spin-on passivation materials. EPO-TEK T3084-A2A and T3084A3A |
2004 |
292KB |
| 60 |
Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology |
Bleed Out Paper II |
2003 |
394KB |
| 59 |
Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma |
Various sterilation processes have different effects on materials and devices. Includes a list of possible adhesives. |
1997 |
173KB |
| 58 |
The Resurgence of LCOS Displays |
Brillian Corp. EPO-TEK T7109-14. Liquid crystal on silicon technology is a compelling display option. |
2004 |
978KB |
| 57 |
Electrical Conductivity of Ferritin Proteins by Conductive AFM |
Epo-Tek 377 bonding Au-substrates on Si |
2005 |
346KB |
| 56 |
Luxeon Emitter Assembly Information |
Thermal Management criteria when designing new Emitters for Power Light Sources. |
2003 |
164KB |
| 55 |
LCoS Display using Inorganic Alignment Layers for VAN LC |
A new assembly process for LCoS microdisplays that enables high contrast, fast display devices when using VAN LC mode |
2001 |
250KB |
| 54 |
Reliability and Degradtion of Organic Light Emitting Devices |
By studying the degradtion of a population of OLED´s, the paper shows that the lifetime of encapsulated devices is increased by more than two orders of magnitude. Princeton University 1994 |
1994 |
227KB |
| 53 |
Composite Ultrasound Arrays for Operation Above 20 MHz |
Methods for fabricating high frequency 2-2 arrays. Penn State University. 1999 SPIE |
1999 |
96KB |
| 52 |
A Compact Ultrasonic Transducer using the Active Piezoceramic Material as an Electronic Carrier |
The integration of sensors and electronics. Ultrasonic Transducer use active piezo. Sweden |
2003 |
93KB |
| 51 |
Epoxies for OptoElectronic Packaging: Applications and Material Propperties |
Materials used in the Assembly of OptoElectronic Packaging |
2003 |
304KB |
| 50 |
SMT Adhesive Dispensing |
Discusses basic adhesive dispensing techniques as well as equipment, methods, environments |
2002 |
111KB |
| 49 |
Bandwidth: Performance and Control in Multimode Fiber |
Introduction to Fiber Optics/Bandwidth |
2002 |
2MB |
| 48 |
Conductive Adhesive for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging |
Thermal Restistance/ThK |
2001 |
523KB |
| 47 |
Study of RF Flip-Chip Assembly with Underfill Epoxy |
Increased reliability from 1.300 to 11,000 fatigue cycles when using EPO-TEK U300 |
1996 |
567KB |
| 46 |
Re-working, Removing, and "Decapsulating" Cured Epoxy |
Methods to remove cured epoxy |
1996 |
119KB |
| 45 |
Solder Joints vs. Conductive Adhesive bonds: A Direct Comparison for SMT Packaging Technologies |
EPO-TEK EE165-3 for CSMA applications |
1998 |
1,4MB |
| 44 |
On The Road To Solder Replacement...An Update On The Technology and Applications |
Process and reliability characteristics of ECS´s used in flip chip bumbing and SMT applications |
1999 |
2,2MB |
| 43 |
Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commercial Millimeter Wave Multi Chip Module |
EPO-TEK H35-175MP in high volume dispense applications and is capable for high frequency applications at 28 GHz frequency |
1999 |
1MB |
| 42 |
Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications |
Key attributes for designing and formulating advanced thermally conductive epoxies |
1999 |
1,4MB |
| 41 |
Wafer Protection with Screen Printable Polyimide |
Advantages of screen printing method for wafer surface protection over other techniques. GB 41 |
1996 |
781KB |
| 40 |
Selecting Epoxies for Optical and Fiber Optic Applications |
Critical physical and performance characteristics of epoxies used in optical and fiber optic applications. GB56 |
1996 |
1,05MB |
| 39 |
Die Attach Adhesives:A Guide to Material Properties and Applications |
Guide to selection of die attach adhesives. GB 48 |
1995 |
1,2MB |
| 38 |
The Suitability of Epoxy-Based Adhesives for use in Medical Devices |
An overview of adhesives in medical applications. GB 63 |
1995 |
897KB |
| 37 |
Thermal Effect of Die Bond Voids |
Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages |
1995 |
2MB |
| 36 |
Technology Assessment: PFC |
Polymer Flip Chip (PFC) Solderless Bump Process. GB31 |
1994 |
1,1MB |
| 35 |
Applying Conductive Polymer Flip Chip, PFC, connector Technology to MCM’s |
Alternatives to wire bonding in connecting thin film resistor networks to alumina substrates |
1994 |
2,5MB |
| 34 |
Fabrication & Assembly Process for Solderless PFC |
High resolution screen printing/stenciling conductive & dielectric polymers for bump flip chip interconnects |
1994 |
4,2MB |
| 33 |
Evaluation of Isotropic Conductive Adhesives for Solder Replacement |
Study to assess suitability of isotropic adhesives intended for replacement of lead bearing solders |
1994 |
3,1MB |
| 32 |
Simple Packaging Process for Chemical Sensors |
Packaging process for silicon-based chemical arrays |
1993 |
758KB |
| 31 |
Polymer Flip Chip, PFC technology assessment of solderless bump process and reliability |
PFC Interconnect Technology increases I/O connections - semiconductor devices |
1993 |
954KB |
| 30 |
Environmental & Reliability Testing of Conductive Polymer PFC Assemblies |
Comparative mechanical, electrical, environmental performance for PFC interconnects |
1993 |
5,5MB |
| 29 |
Solderless Flip Chip |
ECA's play a key role in Solderless Flip Chip Technology |
1992 |
720KB |
| 28 |
A Practical Approach to Die Attach Adhesive Selection |
MIL-STD 883/5011 Conductive Adhesives |
1991 |
854KB |
| 27 |
Die Attach Vce SAT & EJC Performance |
Saturation voltage and thermal resistance performance of die attach adhesives |
1989 |
930KB |
| 26 |
Adhesives for Microelectronics |
Discuss compliance to MIL-A-87172 |
1986 |
2,1MB |
| 25 |
Adhesives for Military Hybrids |
The strengths and limitations of adhesives recently developed to comply for with military specifications |
1986 |
999KB |
| 24 |
Chip Protection on Tape Automated Bonding |
EPO-TEK H70E-2 for T.A.B. bonding |
1985 |
791KB |
| 23 |
Recent Advances Made in Die-Attach Adhesives for Microelectronic Applications |
EPO-TEK H20E-175, H35-175 |
1985 |
2,1MB |
| 22 |
Long Term Strength Characteristics of Conductive Epoxies |
A study to report creep behavior, predicting operational life time, and comparison of mechanical & electrical characteristics. EPO-TEK H20E, H2lD |
1983 |
923KB |
| 21 |
EPO-TEK H20E Conductive Epoxy: The Effects of Mix Ratio & Pot Age on Electrical & Mechanical Performance |
How mix ratio effects properties |
1983 |
1,4MB |
| 20 |
A Performance Evaluation of a High Density Hermetic Assembly Using Die Attachment |
Evaluation of hi rel hermetic I.C. packaging under various stress conditions. EPO-TEK H20E |
1983 |
745KB |
| 19 |
Thermal Effect of Die Bond Voids |
Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages |
1984 |
5,5MB |
| 18 |
The Effect of Porosity on Mechanical, Electrical & Thermal Characteristics of Cond. Die Attach Adhesives |
Comparison of EPO-TEK materials with others for die attach. Results include volatile materials, die & lap shear, outgassing , electricals. EPO-TEK H20E, B/9028 |
1984 |
2,4MB |
| 17 |
Conductive Epoxy Solves Surface Mount Problems |
CSMA's to bond surface mount components. EPO-TEK H20E, H70E-4 |
1984 |
1,1MB |
| 16 |
Computer Designed, Multi-layer Hybrid Substrate using Thick Film Technology |
Screenprinting multilayer designs using TFT. EPO-TEK H20E, H77 vs Cermalloy |
1982 |
252KB |
| 15 |
Outgassing Characteristics of Conductive Die Attach Materials as a Function of Metallic Filler |
Epoxy outgassing effects as a function of different metallic fillers; modified polyimide, pure polyimide, silver, gold, copper, nickel, palladium/silver |
1982 |
724KB |
| 14 |
Current Technology of Die Attach Materials - Epoxy or Polyimide |
Comparisons of Epoxy vs. Polyimides; physical, mechanical, electrical properties; EPO-TEK H20E, H27D, P-7, P-1011. |
1979 |
2,3MB |
| 13 |
Skin Problems - A Top Job Hazard |
Precautions and preventative procedures of skin dermatitis |
1979 |
302KB |
| 12 |
Epoxy Bleedout in Ceramic Chip Carriers |
What resin “bleedout” is and how to avoid it, experimental procedures and control of resin bleedout. EPO-TEK H20E |
1995 |
502KB |
| 11 |
The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications |
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK 301, 301-2, 330, 353ND, 377, 360ST, 360T |
1980 |
903KB |
| 10 |
The Significance of Glass Transition Temperature on Electrically Conductive Epoxy Resins in Hybrid Microelectronics |
Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK H20E, H21D, H27D, H81 |
1979 |
637KB |
| 9 |
What Next for Epoxies |
Versatality of epoxies |
1969 |
387KB |
| 8 |
Considerations in Selecting Electrically Conductive Epoxies for Die Bonding |
How to select the best ECA |
1973 |
179KB |
| 7 |
Substrate Attach Epoxies |
H74 vs Ablebond et al. - (Procedures) insulative adhesives - ceramic to gold-plated Kovar, and ceramic to ceramic |
1975 |
359KB |
| 6 |
Epoxy Device Bonding & Die Handling Techniques for Hybrid Microcircuits |
H40, H41, H43, H61, H74 - epoxies in high rel microcircuits, hermetic sealing, epoxy vs eutectic, assembly techniques for hybrids |
1972 |
875KB |
| 5 |
Electrically Conductive Epoxies for Screen Printing Applications |
H20E, H31 - mfg. related problems in screen printing conductive epoxies for die attach |
1975 |
529KB |
| 4 |
Epoxy Techniques for Hybrid Microwave Integrated Circuits |
H20E, H72 - epoxies at microwave frequencies on hybrid devices, eutectic vs epoxy substrate bonding, techniques of application |
1974 |
337KB |
| 3 |
Advances in Epoxy Die Attach |
Epoxies for die & substrate attachment, TGA, DTA, curing, mechanical advantages, reliability, performance |
1975 |
510KB |
| 2 |
Use of Conductive Epoxies for Die Attach |
H20E, H31D for die attach, semiconductor chips, lap shear, volume resistivity, thermal resistance and analysis, TMA & TGA |
1971 |
817KB |
| 1 |
New Epoxy Systems for Microelectronics |
H20E - comparison; 1 & 2 component, electrically conductive systems, eutectic vs. epoxy, outgassing, die attach, LED, current density, lap shear, saturation voltage, thermal resistance |
1976 |
589KB |
