Technical Papers

Im Folgenden finden Sie unterschiedliche Applikationsberichte der Firma Epoxy Technology.

Nr.	Titel	Beschreibung	Datum	Größe
65	Crystallization	What is Epoxy Resin Crystallization?	2008	153KB
64	High Frequency Properties of Passive Materials for Ultrasonic Transducers	Epo-Tek 301 for Ultrasonic Transducers	2001	948KB
63	A Three Axis Micropositioner for ultrahighvacuum use based on the inertial slider principle	UHV compatible Epo-Tek H35-175MPLV for bonding piezoelectric components	1995	290KB
62	Fabricating Large Arrays of Microwells with Arbitrary Dimensions and Filling Them Using Discontinuous Dewetting	Epo-Tek UVO114 for molding against PDMS	1998	910KB
61	Screen Printable Polymers for Wafer Level Packaging: A Technology Assessment	Screen printable wafer coatings have many advantages over tradition spin-on passivation materials. EPO-TEK T3084-A2A and T3084A3A	2004	292KB
60	Preventing Adhesive Resin Bleed in Microelectronics Assembly through Gas Plasma Technology	Bleed Out Paper II	2003	394KB
59	Compatibility of Medical Devices and Materials with low-Temperature Hydrogen Peroxide Gas Plasma	Various sterilation processes have different effects on materials and devices. Includes a list of possible adhesives.	1997	173KB
58	The Resurgence of LCOS Displays	Brillian Corp. EPO-TEK T7109-14. Liquid crystal on silicon technology is a compelling display option.	2004	978KB
57	Electrical Conductivity of Ferritin Proteins by Conductive AFM	Epo-Tek 377 bonding Au-substrates on Si	2005	346KB
56	Luxeon Emitter Assembly Information	Thermal Management criteria when designing new Emitters for Power Light Sources.	2003	164KB
55	LCoS Display using Inorganic Alignment Layers for VAN LC	A new assembly process for LCoS microdisplays that enables high contrast, fast display devices when using VAN LC mode	2001	250KB
54	Reliability and Degradtion of Organic Light Emitting Devices	By studying the degradtion of a population of OLED´s, the paper shows that the lifetime of encapsulated devices is increased by more than two orders of magnitude. Princeton University 1994	1994	227KB
53	Composite Ultrasound Arrays for Operation Above 20 MHz	Methods for fabricating high frequency 2-2 arrays. Penn State University. 1999 SPIE	1999	96KB
52	A Compact Ultrasonic Transducer using the Active Piezoceramic Material as an Electronic Carrier	The integration of sensors and electronics. Ultrasonic Transducer use active piezo. Sweden	2003	93KB
51	Epoxies for OptoElectronic Packaging: Applications and Material Propperties	Materials used in the Assembly of OptoElectronic Packaging	2003	304KB
50	SMT Adhesive Dispensing	Discusses basic adhesive dispensing techniques as well as equipment, methods, environments	2002	111KB
49	Bandwidth: Performance and Control in Multimode Fiber	Introduction to Fiber Optics/Bandwidth	2002	2MB
48	Conductive Adhesive for Thermal Management: Case Study Issues in Hybrid Microelectronics and Plastic IC Packaging	Thermal Restistance/ThK	2001	523KB
47	Study of RF Flip-Chip Assembly with Underfill Epoxy	Increased reliability from 1.300 to 11,000 fatigue cycles when using EPO-TEK U300	1996	567KB
46	Re-working, Removing, and "Decapsulating" Cured Epoxy	Methods to remove cured epoxy	1996	119KB
45	Solder Joints vs. Conductive Adhesive bonds: A Direct Comparison for SMT Packaging Technologies	EPO-TEK EE165-3 for CSMA applications	1998	1,4MB
44	On The Road To Solder Replacement...An Update On The Technology and Applications	Process and reliability characteristics of ECS´s used in flip chip bumbing and SMT applications	1999	2,2MB
43	Statistical Process Control Applied to Automated Dispense of Silver Filled Epoxy for Commercial Millimeter Wave Multi Chip Module	EPO-TEK H35-175MP in high volume dispense applications and is capable for high frequency applications at 28 GHz frequency	1999	1MB
42	Advanced Boron Nitride Epoxy Formulations Excel in Thermal Management Applications	Key attributes for designing and formulating advanced thermally conductive epoxies	1999	1,4MB
41	Wafer Protection with Screen Printable Polyimide	Advantages of screen printing method for wafer surface protection over other techniques. GB 41	1996	781KB
40	Selecting Epoxies for Optical and Fiber Optic Applications	Critical physical and performance characteristics of epoxies used in optical and fiber optic applications. GB56	1996	1,05MB
39	Die Attach Adhesives:A Guide to Material Properties and Applications	Guide to selection of die attach adhesives. GB 48	1995	1,2MB
38	The Suitability of Epoxy-Based Adhesives for use in Medical Devices	An overview of adhesives in medical applications. GB 63	1995	897KB
37	Thermal Effect of Die Bond Voids	Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages	1995	2MB
36	Technology Assessment: PFC	Polymer Flip Chip (PFC) Solderless Bump Process. GB31	1994	1,1MB
35	Applying Conductive Polymer Flip Chip, PFC, connector Technology to MCM’s	Alternatives to wire bonding in connecting thin film resistor networks to alumina substrates	1994	2,5MB
34	Fabrication & Assembly Process for Solderless PFC	High resolution screen printing/stenciling conductive & dielectric polymers for bump flip chip interconnects	1994	4,2MB
33	Evaluation of Isotropic Conductive Adhesives for Solder Replacement	Study to assess suitability of isotropic adhesives intended for replacement of lead bearing solders	1994	3,1MB
32	Simple Packaging Process for Chemical Sensors	Packaging process for silicon-based chemical arrays	1993	758KB
31	Polymer Flip Chip, PFC technology assessment of solderless bump process and reliability	PFC Interconnect Technology increases I/O connections - semiconductor devices	1993	954KB
30	Environmental & Reliability Testing of Conductive Polymer PFC Assemblies	Comparative mechanical, electrical, environmental performance for PFC interconnects	1993	5,5MB
29	Solderless Flip Chip	ECA's play a key role in Solderless Flip Chip Technology	1992	720KB
28	A Practical Approach to Die Attach Adhesive Selection	MIL-STD 883/5011 Conductive Adhesives	1991	854KB
27	Die Attach Vce SAT & EJC Performance	Saturation voltage and thermal resistance performance of die attach adhesives	1989	930KB
26	Adhesives for Microelectronics	Discuss compliance to MIL-A-87172	1986	2,1MB
25	Adhesives for Military Hybrids	The strengths and limitations of adhesives recently developed to comply for with military specifications	1986	999KB
24	Chip Protection on Tape Automated Bonding	EPO-TEK H70E-2 for T.A.B. bonding	1985	791KB
23	Recent Advances Made in Die-Attach Adhesives for Microelectronic Applications	EPO-TEK H20E-175, H35-175	1985	2,1MB
22	Long Term Strength Characteristics of Conductive Epoxies	A study to report creep behavior, predicting operational life time, and comparison of mechanical & electrical characteristics. EPO-TEK H20E, H2lD	1983	923KB
21	EPO-TEK H20E Conductive Epoxy: The Effects of Mix Ratio & Pot Age on Electrical & Mechanical Performance	How mix ratio effects properties	1983	1,4MB
20	A Performance Evaluation of a High Density Hermetic Assembly Using Die Attachment	Evaluation of hi rel hermetic I.C. packaging under various stress conditions. EPO-TEK H20E	1983	745KB
19	Thermal Effect of Die Bond Voids	Effect of die bond voids on thermal performance of ceramic, metal, and plastic packages	1984	5,5MB
18	The Effect of Porosity on Mechanical, Electrical & Thermal Characteristics of Cond. Die Attach Adhesives	Comparison of EPO-TEK materials with others for die attach. Results include volatile materials, die & lap shear, outgassing , electricals. EPO-TEK H20E, B/9028	1984	2,4MB
17	Conductive Epoxy Solves Surface Mount Problems	CSMA's to bond surface mount components. EPO-TEK H20E, H70E-4	1984	1,1MB
16	Computer Designed, Multi-layer Hybrid Substrate using Thick Film Technology	Screenprinting multilayer designs using TFT. EPO-TEK H20E, H77 vs Cermalloy	1982	252KB
15	Outgassing Characteristics of Conductive Die Attach Materials as a Function of Metallic Filler	Epoxy outgassing effects as a function of different metallic fillers; modified polyimide, pure polyimide, silver, gold, copper, nickel, palladium/silver	1982	724KB
14	Current Technology of Die Attach Materials - Epoxy or Polyimide	Comparisons of Epoxy vs. Polyimides; physical, mechanical, electrical properties; EPO-TEK H20E, H27D, P-7, P-1011.	1979	2,3MB
13	Skin Problems - A Top Job Hazard	Precautions and preventative procedures of skin dermatitis	1979	302KB
12	Epoxy Bleedout in Ceramic Chip Carriers	What resin “bleedout” is and how to avoid it, experimental procedures and control of resin bleedout. EPO-TEK H20E	1995	502KB
11	The Significance of Glass Transition Temperature on Epoxy Resins for Fiber Optic Applications	Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK 301, 301-2, 330, 353ND, 377, 360ST, 360T	1980	903KB
10	The Significance of Glass Transition Temperature on Electrically Conductive Epoxy Resins in Hybrid Microelectronics	Methods to determine Tg, the influence of cure schedule on Tg, Tg vs. Cure. EPO-TEK H20E, H21D, H27D, H81	1979	637KB
9	What Next for Epoxies	Versatality of epoxies	1969	387KB
8	Considerations in Selecting Electrically Conductive Epoxies for Die Bonding	How to select the best ECA	1973	179KB
7	Substrate Attach Epoxies	H74 vs Ablebond et al. - (Procedures) insulative adhesives - ceramic to gold-plated Kovar, and ceramic to ceramic	1975	359KB
6	Epoxy Device Bonding & Die Handling Techniques for Hybrid Microcircuits	H40, H41, H43, H61, H74 - epoxies in high rel microcircuits, hermetic sealing, epoxy vs eutectic, assembly techniques for hybrids	1972	875KB
5	Electrically Conductive Epoxies for Screen Printing Applications	H20E, H31 - mfg. related problems in screen printing conductive epoxies for die attach	1975	529KB
4	Epoxy Techniques for Hybrid Microwave Integrated Circuits	H20E, H72 - epoxies at microwave frequencies on hybrid devices, eutectic vs epoxy substrate bonding, techniques of application	1974	337KB
3	Advances in Epoxy Die Attach	Epoxies for die & substrate attachment, TGA, DTA, curing, mechanical advantages, reliability, performance	1975	510KB
2	Use of Conductive Epoxies for Die Attach	H20E, H31D for die attach, semiconductor chips, lap shear, volume resistivity, thermal resistance and analysis, TMA & TGA	1971	817KB
1	New Epoxy Systems for Microelectronics	H20E - comparison; 1 & 2 component, electrically conductive systems, eutectic vs. epoxy, outgassing, die attach, LED, current density, lap shear, saturation voltage, thermal resistance	1976	589KB