Polytec PT GmbH provides a wide range of thermally conductive, electrically insulating adhesives for heat sinking and heat dissipation applications. All adhesives are 100% solids and solvent free.
These epoxy systems are designed for die attach, substrate attach as well as for hermetic sealing and have all the physical properties needed to meet the demanding requirements of today´s semiconductor market.
Typical properties:
high shear strength
low voiding on cure
ionic purity
low moisture absorption
long pot life
For more detailed information and data sheet download please visit our
German homepage www.polytec-pt.de |
Thermally Conductive Adhesive Selection Guide (PDF, 550 KB)
