Resbond Ceramic Adhesives were designed to satisfy the most difficult, high temperature application requirements. They are based on high purity, ceramic binders and selected reinforcing fillers. They have excellent adhesion to ceramics, metals, glass and plastics.
Resbond Ceramic Adhesives offer excellent high temperature stability, dielectric strength, mechanical properties and thermal shock resistance. They are resistant to molten metals, oxidizing and reducing atmospheres, most chemicals and solvents. These adhesives can be easily cured at room temperature without objectionable odors, VOC´s or outgassing.
Available in a wide range of temperature capabilities, viscosities, strengths, conductivities, expansion rates and dielectric strengths they are the ideal choice for research, electronics, metallurgical, nuclear and industrial applications.
For more detailed information and data sheet download please visit our German homepage www.polytec-pt.de |
