TechFilm film adhesives and preforms can be used in many different industrial applications to bond a wide variety of materials. Users of solvent born adhesives will find many benefits in using our 100% solid systems. Key points are summarized below.
Method of Use
A preform or film adhesive is applied to one component or substrate and the carrier sheet is removed. The part is then mated with the other component and the assembly is heated to the activation temperature. Curing schedules (time, temperature and pressure) are determined by the materials being bonded and finished product performance requirements.
Substrates that can be bonded
Aluminum
Ceramic
Copper
Engineered thermoplastics FR4 ("epoxy glass")
Glass
Gold
Invar
Kapton
Kovar
Nickel
Other Metals
Available as:
thermally conductive, electrically conductive or insulating formulations
Custom manufactured films and preforms
Low cure temperatures, long shelf life at room temperature and short cure schedules
Supported films and preforms available from 3 to 10 mils
Supported films and preforms available in sheets up to 16" square and continuous rolls
Unsupported films and preforms available from 1 to 10 mils
Benefits:
Consistency of adhesive
Consistency of finished product quality (part-to-part and lot-to-lot repeatability)
Ease of application (fast, easy and accurate)
Easily meets OSHA and EPA guidelines
Flexible product design (not limited by liquid adhesive application difficulties)
No adhesive squeeze out on finished parts
No equipment clean up
No mess, fumes or noxious odors
No pot life restrictions
No waste disposal
|
