Epo-Tek T7109-14 is a flexible epoxy paste with superior thermal conductivity.  It is commonly used where low stress and heat dissipation is essential such as attaching large dies, displays and LCDs.

Duralco 4525 is a two-part adhesive designed for high temperature environments. It is chemically resistant, exhibits low shrinkage, absorbs minimal moisture, has high electrical resistance and cures at room temperature.

NuSil CV-1152 is a single component, flowable silicone specially designed and processed for applications requiring extreme low temperature, low outgassing and minimal volatile condensables under extreme operating conditions.

Polybond OL-17 is a UV-curing adhesive for temporary mounting of products requiring dicing, polishing and other machining processes. It exhibits high bond strength and adheres perfectly to glass, metals and ceramics. It can be removed by washing.

LS-1246 is a one-part, non curing, ultra-clear, thixotropic optical gel designed to match the refractive index of silica. It is an excellent solution for low-loss index matching requirements in silica fiber splices and polymer waveguide connections.

TechFilm TF T2222F is a high performance thermally conductive B-staged film adhesive specially formulated for bonding to gold and other hard-to-bond substrates. It cures at 130°C and features good chemical, heat and moisture resistance.